Thermal science
Microchannel design, enhanced boiling surfaces, hotspot control, and temperature uniformity.
Cooling management technology R&D company
TEKERPRISE： Technologies For Your Enterprise.
Low-pressure two-phase cooling for the AI compute era.
TEKERPRISE develops microjet dielectric phase-change cold plates, immersion evaporators, and rack-level two-phase cooling architectures for high-power chips and dense enterprise computing systems.
Company
An R&D company focused on cooling management for high-power electronics.
TEKERPRISE works at the intersection of heat transfer, microfluidics, mechanical integration, and deployment engineering. Our focus is practical cooling management for AI accelerators, GPUs, advanced packages, power devices, high-density servers, and data center infrastructure.
The company is translating microchannel water-based single-phase research, microjet dielectric phase-change cold plates, immersion evaporators, and low-pressure two-phase systems into deployable product and system platforms.
Prototype engineering
Cold plate geometry, vapor return, dielectric fluid handling, sealing, and compact integration.
System verification
Bench testing, closed-loop validation, pressure-drop evaluation, and server/rack architecture work.
Why it matters
AI and HPC systems are pushing beyond single-phase cooling limits.
Higher chip power
AI training, inference, and HPC workloads keep increasing processor power and local heat flux.
Pressure and pumping load
Conventional single-phase water systems face rising pressure drop and pump power requirements.
Reliability exposure
Leakage risk, service interruption, and maintenance cost become major barriers at data center scale.
System scalability
Cold plate capacity alone is not enough; thermal resistance, seals, pipes, joints, and rack loops matter.
Technologies
Microjet-fed, microchannel two-phase dielectric cooling.
The system removes extreme chip heat through controlled coolant phase change inside an engineered cold plate. It is waterless at the chip interface, direct-to-chip, compact, and designed for low-pressure operation.
01
Dielectric liquid inlet
Low-boiling-point dielectric working fluid enters the engineered plate.
02
Microjet distribution
Internal micro-distributors feed microchannels across the heat source.
03
Enhanced phase change
Micro-/nano-structures increase boiling heat transfer and uniformity.
04
Vapor outlet and return
Low-resistance passages route vapor-liquid return toward condensation.
Direct-to-chip cold plates
6 kW-class single cold plate cooling for GPUs, AI accelerators, 3DIC packages, and power devices.
Immersion evaporators
Liquid evaporators for immersion systems with high heat-flux chip and power-electronics loads.
Rack cooling architecture
Parallel cold plate connection, vapor-liquid return, centralized condensation, storage, and pumping.
Performance
Reported prototype performance, displayed as engineering parameters.
Thermal load handling
reported prototype values
<0.007 K/W
thermal resistance
<20 kPa
pressure drop at 4000 W
<20 mm
overall cold plate height
>130 W/cm2
immersion evaporator heat flux
| Category | Parameter | Value |
|---|---|---|
| Two-phase cold plate | Single plate cooling power | Over 6,000 W |
| Two-phase cold plate | Heat flux | Above 300 W/cm2 |
| Two-phase cold plate | Thermal resistance | Below 0.007 K/W |
| System | Operating pressure | Below 3 bar |
| System | Pressure drop | Below 20 kPa at 4000 W |
| Mechanical | Cold plate height | Below 20 mm |
| Immersion evaporator | Single-chip heat load | Above 3,000 W |
| Immersion evaporator | Heat flux | Above 130 W/cm2 |
Applications
From high-power chips to dense rack operation.
AI accelerators and GPUs
Direct-to-chip cooling for high-power packages and next-generation processor roadmaps.
Advanced packages and power devices
High heat flux cooling for 3DIC packages, power modules, and dense electronic assemblies.
Immersion servers
Liquid evaporators for immersion cooling scenarios with high single-chip heat loads.
Server and rack systems
Parallel cold plates, vapor-liquid return, centralized condensation, storage, and low-pressure pumping.
Contact
Start a technical discussion with TEKERPRISE.
Share the chip power map, package size, allowable pressure, coolant and facility conditions, target server form factor, and prototype timeline. The team supports customized cold plate design, prototype testing, and system-level verification.
ContactZhengduo Zhu
Phone+61 451778535